Tssop 14 Package
Tssop 14 Package package drawing tssop 14 lead plastic 4 05 08 1650 title package drawing tssop 14 lead plastic 4 05 08 1650 author linear technology corporation keywords packaging created date 7 25 2005 8 41 16 am14 lead thin shrink small outline package tssop ru 14 a 14 lead thin shrink small outline package tssop ru 14 dimensions shown in millimeters 5 4 4 4 14 8 1 7 6 bsc pin 1 5 4tssop14 package packing information toshiba jump to package packing information before creating and producing designs and using customers must also refer to and comply with the latest versions of all relevant toshiba information and the inpcb soic tssop 14 to dip adapter protosupplies it is designed for soic 14 and tssop 14 packages but it may fit other packages such as ssop that share the same lead pitch refer to the pad dimensions to determine suitability for mounting a particutssop 14 package tssop14 pacchetti tssop packaging tssop tssop 14 package tssop tssop 14 package tssop14 pacchettitssop 14 tssop 14 a 14 lead thin shrink small outline package tssop ru 14 dimensions shown in millimeters 5 5tssop 16 package dimensions not2fast june 2002 rev a dimensions are in millimeters 2002 fairchild semiconductor corporation 16 lead tssop package dimensions tssop 16 6 5 0soic 14 fs pkg code s2 glacier icecube build and soic 14 fs pkg code s2 soic 14 package dimensions july 1999 rev a 1 1 scale 1 1 on letter size paper dimensions shown below are in inches millimeters part weight per unit gram 0 land patternpackage dimensions msop ssop tssop a2 ic haus ic haus application guide more package info title package dimensions msop ssop tssop a2 created date 8 4 2006 1 07 11 pmsmall outline integrated circuit wikipedia a small outline integrated circuit soic is a surface mounted integrated circuit ic package which occupies an area about 30 50 less than an equivalent dual in line package dip with a typical.
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