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Tssop16 Thermal Resistance

Tssop16 Thermal Resistance

Tssop16 Thermal Resistance tssop20 footprint datasheet applicatoin notes tssop20 footprint dimensions in mm 7 4 0 6 0 11 13 ordering fully functional operating ambient temperature 25 to 85 c tssop20 applications i unit 90 c w tssop20 thermal resistance jst202eb st202ec st232eb st232ec st 6 thermal characteristics table 12 absolute maximum ratings package symbol value board type unit so16 r thja 1 115 1 layer board c w 80 4 layer board r thjc 2 30 1 layer board tssop16 95 r thjatps53114 single synchronous step down controller for low r jc bot junction to case bottom thermal resistance 4 n a 1 for more information about traditional and new thermal metrics see the ic package thermal metrics application report spra953 7 eleclittle foot tssop 8 the next step in surface mount power the next step in surface mount power mosfets wharton mcdaniel and david oldham when vishay siliconix introduced its little foot mosfets it was the first time that power mosfets had been offered in ahtssop16 datasheet applicatoin notes datasheet archive text protection thermal shutdown package htssop16 table 1 htssop16 exposed pad order codes packing l6732 htssop16 tube l6732tr june 2008 package htssop16 over voltage protection feed back d16 thermal resistance circuits web the thermal resistance increases as increases as decreases and as decreases figure 16 heat transfer across a composite slab series thermal resistance the concept of a thermal resistance circuitncp1568 ac dc active clamp flyback pwm ic tbd suffix plastic package tssop16 pd max 833 mw thermal resistance junction to ambient 1 oz cu printed circuit copper clad tbd suffix plastic package tssop16 r ja 150 c w esd capability humanthermal resistance njr the thermal resistance of a ic package is calculated by the difference between tj and the ambient temperature ta under the co ndition that the ic package dissipates electric power of 1w here are thlm5032 high voltage dual interleaved current mode controller r jc top junction to case top thermal resistance 30 r jb junction to board thermal resistance 42 c w jt junction to top characterization parameter 1 jb junction to board characterization pasemiconductor and ic package thermal metrics rev c semiconductor and ic package thermal metrics 1 r ja junction to ambient and r jma junction to moving air the junction to ambient thermal resistance r ja is the most commonly reported thermal me.

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